HILL TOP SUMMER CAMP
Three exciting Hill Top Summer Camp Programs!
Hill Top Summer Camp is designed for students entering grades 2–9 with predictability and consistency in a daily program.
Each morning and afternoon, campers are provided with information about the events of that day or activities they can look forward to later in the week.
Campers learn age-appropriate social skills throughout the day from our experienced staff, and are reinforced with positive feedback at the end of each day.
Academic remediation, facilitated by certified teachers, is available to campers who need support in writing and/or math.
Healthy snacks are provided twice daily.
Once a week, all campers attend a trip off campus; past trips include the Philadelphia Zoo, Bowling, Dorney Park and the Franklin Institute.
Optional supervised early care is available from 8:00-9:15 each morning and late care from 3:30-5:00 each evening.
With three main programs – Outdoor Adventurers, Arts & Crafts, and STEM Scholars – families are welcome to choose any combination they would like. Each program will run every week of camp, allowing our campers to focus on what they enjoy. You could choose one program for the full 6 weeks of camp, or mix and match for variety! Certain activities, such as swimming and ESY Academic Support, will still be scheduled for all campers in all programs when necessary.
Spend your days outside hiking Radnor’s local parks, walking the streams and creeks, and exploring nature on and around Hill Top’s campus. Our Outdoor Adventurers will learn about the world around us in a fun, hands-on manner.
Arts & Crafts
Does your child enjoy being creative? The Arts & Crafts program will focus on traditional art mediums like painting, drawing, and sculpture, as well as digital art creation. Campers will also enjoy crafting projects such as sewing and candle making, just to name a few.
Our STEM Scholars program is great for campers who love technology. Through hands-on projects, campers will learn about fun science topics, coding, electronics, engineering, 3D modeling, and Esports.